The International Core Academy of Sciences and Humanities (CORE Academy) is pleased to serve as an organizer and supporter of the International Conference “Semiconductor Physics and Its Applications: Development Opportunities in Uzbekistan,” to be held in Tashkent, Uzbekistan, from September 28 to October 1.
This important international conference will bring together researchers, engineers, and industry experts to present and discuss recent advances in semiconductor science, technology, and applications. As one of the organizing and supporting institutions, CORE Academy is honored to stand alongside its partners in fostering international academic exchange, scientific dialogue, and forward-looking cooperation in a field of growing importance to the future of energy, industry, and digital development.
General Information
The conference aims to provide a high-level international forum for the exchange of ideas and research findings in the broad field of semiconductor science and technology. It welcomes contributions addressing recent advances in semiconductor materials, devices, integrated circuits, packaging technologies, sensors, and photovoltaic systems.
A central objective of the conference is to bridge fundamental semiconductor physics, device engineering, system-level integration, and industrial applications. Particular emphasis is placed on technologies that support the energy transition, digitalization, and advanced manufacturing, as well as on development opportunities, infrastructure building, and international collaboration relevant to Uzbekistan and the broader Central Asian region.
The conference welcomes original research papers, review articles, and industrial case studies covering both theoretical and applied aspects of semiconductor science and technology.
Conference Sections
The conference program includes the following major sections:
I. Power Electronics and Wide-Bandgap Devices
This section covers topics such as the growth and defect engineering of 4H-SiC and 6H-SiC single crystals, GaN-based heterostructures, advanced SiC MOSFETs, GaN HEMTs, vertical GaN power devices, and high-temperature and radiation-hardened power devices. It also includes applications in renewable energy systems, electric vehicles, and industrial drives.
II. Sensors and MEMS Systems
This section focuses on temperature, pressure, flow, humidity, and gas sensors, as well as optical and photonic sensors, Sensor-on-Chip and System-in-Package solutions, CMOS–MEMS co-integration technologies, and edge-AI-enabled sensors. Applications for IoT, industrial condition monitoring, and self-powered sensing systems are also included.
III. Flexible Integrated Circuits and Electronics
Topics in this section include IGZO thin-film transistors, organic thin-film transistors, two-dimensional materials such as MoS₂, WS₂, and graphene, flexible sensor arrays, electronic skin systems, wearable and biomedical electronics, and printed electronics.
IV. Advanced Packaging and Heterogeneous Integration
This section addresses System-in-Package integration, power SiP solutions for wide-bandgap electronics, heterogeneous integration of CMOS, MEMS, photonics, and power devices, as well as advanced thermal management and high-temperature, high-power packaging technologies.
V. Advanced Solar Cells and Photovoltaic Technologies
This section includes thin-film photovoltaics, perovskite solar cells, tandem solar cells, advanced characterization of photovoltaic materials and devices, and the integration of photovoltaic technologies into power electronics and energy systems.
VI. Integrated Circuit (IC) Design and Electronic Systems
This section covers analog, mixed-signal, and RF IC design, IC design for SiC and GaN power electronics, sensor interface and readout ICs, digital IC design, System-on-Chip architectures, and EDA tools, design flows, MPW runs, and tape-out experience.
Key Organizers
The conference is being organized with the support and participation of a broad consortium of institutions, including:
“Uzeltexsanoat” Association
Ministry of Digital Technologies of the Republic of Uzbekistan
Ministry of Higher Education, Science and Innovations of the Republic of Uzbekistan
Academy of Sciences of the Republic of Uzbekistan
The Council of Physicists of Uzbekistan
International Core Academy of Sciences and Humanities
Asian Academy of Sciences
New Uzbekistan University
National University of Uzbekistan named after Mirzo Ulughbek
Tashkent State Technical University named after I.A. Karimov
Samarkand State University named after Sh.R. Rashidov
Namangan State University
Namangan State Technical University
Ferghana State University
Ferghana State Technical University
Karakalpak State University
Urgench State University named after Abu Raihan Biruni
Tashkent University of Information Technologies named after Muhammad al-Khwarizmi
Andijan State University, named after Zahiriddin Muhammad Bobur
Tashkent University of Technology
Institute of Nuclear Physics
Physical-Technical Institute named after S.A. Azimov
Institute of Ion-Plasma and Laser Technologies named after U.A. Arifov
Institute of Polymer Physics and Chemistry
Institute of Material Sciences
Institute of Semiconductor Physics and Microelectronics of the National University of Uzbekistan
Institute of Advanced Studies of the New Uzbekistan University
Together, these institutions reflect the broad academic, scientific, technological, and policy support behind the conference and underscore its significance as a major platform for international collaboration in semiconductor research and innovation.
Closing Remarks
CORE Academy warmly welcomes this important initiative and is pleased to contribute to its organization and support. At a time when semiconductor science and technology are increasingly central to industrial innovation, energy transformation, digital infrastructure, and national development, international cooperation in this field is of particular importance.
We warmly welcome researchers, engineers, industry experts, and interested institutions to participate in, support, and help promote this conference. We believe that gatherings of this kind can serve not only as venues for scholarly exchange, but also as bridges linking scientific excellence, technological progress, and long-term international partnership.
For further information, please visit the conference website at: http://www.semiconuz.org/index.html. Should you have any questions, please feel free to contact the Secretariat of CORE Academy at secretariat@coreacad.org.
